| Chemical Analysis |
| Alloy Chemistry |
| On-Site PMI Testing |
| Positive Material Identification |
| Metallic Material Verification |
|
| |
| ICP Analysis |
| OES Analysis |
| C,S, H, O, N Analysis |
| Rare Earth Elements |
|
| SEM-EDS Analysis |
| Chemical Resistance Testing |
| Density of Powdered Metals |
| Ion Chromatography |
| Halogen Analysis |
|
| Polymeric Material Verification |
| FTIR Analysis |
| GCMS Analysis |
| Filler Content Analysis |
| Coating Weight |
|
| X-Ray Diffraction Testing |
| (XRD) |
| Phase Identification |
| Percent Crystallinity |
|
| Powder Diffraction |
| Corrosion Product Analysis |
| Powder Morphology |
| Contaminant/Corrodent ID |
|
| | |
| Corrosion Testing |
| Salt Spray Testing |
| Humidity & Water Fog Testing |
| CASS Testing |
|
| New Services |
| Temperature and Humidity |
| Testing |
| QUV Exposure |
|
| | |
| Corrosion Failure Analysis |
| SCC/ESC Evaluation |
| Evaluation of Duplex Stainless |
| Steels |
| Formicary Corrosion of |
| Copper Tubing (Ant's Nest) |
| |
|
| |
| General/Pitting Corrosion |
| Testing |
| Passivation Testing of Medical |
| Components |
| Sensitization testing of Ferritic |
|
& Austenitic Stainless Steels
|
|
| | |
| Mechanical Testing |
| Tensile Testing |
| Tube Tensile Testing |
| Charpy Impact Testing |
| (-320F to 450F) |
| Hydrogen Embrittlement |
| Weld Tensile Testing |
|
| Fastener Testing |
| Flattening |
| Hardness (Rockwell, Brinell) |
| Heat Treatment (furnace to |
| 2100F) |
| Sample Machining & |
| Preparation |
|
| Weld Qualification |
| Certified Welder Inspections |
|
| 3 Point Bend Testing |
| 4 Point Bend Testing |
|
| | |
| Metallurgy & Failure |
| Case depth |
| Decarburization |
| Grain size |
| Inclusion rating |
|
|
| Coatings evaluations |
| Fractography |
| Heat treat analysis |
| Intergranular attack |
|
| Intergranular oxidation |
| Macro, micro & SEM |
| photography |
| Microstructure |
| Plating & coating analysis |
|
| Light microscopy |
| Microhardness (Knoop, |
| Vickers) |
| Particle analysis (ID, size) |
| Plating thickness |
|
| Porosity of metals, ceramics |
| and composites |
| Quantitative image analysis |
| Surface Topography |
| Circuit Board Analysis |
|
| Prior austenitic grain boundary |
| determination |
| SEM Analysis |
| Electronics Analysis |
|
|
