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ELECTRONICS TESTING

The IMR Test Labs electronics testing group has numerous tools at its disposal, geared toward providing accurate, concise solutions. IMR’s professional and knowledgeable staff delivers clear reports, solving a variety of challenging situations. Our expert electronics testing group relies on the extensive resources of the entire organization, utilizing advanced tools and techniques, such as SEM/EDS and cross sectional analysis, to inspect product and process quality and diagnose component failures. Reports and images can be transmitted electronically. For information about our electronics product testing capabilities, including destructive physical analysis, thermal cycling, contamination analysis and solderability, contact:

Ed Brothers (Senior Research Scientist, Microanalysis Specialist in NY),
Neil Burns (Manager of Failure Analysis & Engineering in NY) or
Tom Ackerson (Director of Metallurgy in KY).

   

   
 
   
 
   
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Related Bios
Learn more about Ed Brothers, Senior Research Scientist.
Learn more about Neil Burns, Manager of Failure Analysis and Metallurgical Engineering
   
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IMR performs a number of testing services, such as SEM/EDS, X-Ray, and more, including:

 
Our electronics testing is the best.
Etched Solder Joint
Intermetallic Layer

• Cross sectional analysis
• Photomicrographs
• Failure mode & defect analysis
• Real-time X-Ray Radiography
• Adhesion/bond strength
• DPA Destructive physical analysis
• Packaging problems
• Shear strength
• Plating thickness
• Conductivity & resistivity
• Thermal cycling
• Visual inspections
• SEM/EDS and FTIR analysis
• Contamination analysis
• Wire bond pull tests
• Silicon wafer defects
• Strain gaging
• Steam aging
• Solderability testing
• Thermal cycling
• Peel testing
• Tensile tests
• Dimensional verification
• Passive component failure