The IMR Test Labs electronics testing group has numerous tools at its disposal, geared toward providing accurate, concise solutions. IMR’s professional and knowledgeable staff delivers clear reports, solving a variety of challenging situations. Our expert electronics testing group relies on the extensive resources of the entire organization, utilizing advanced tools and techniques, such as SEM/EDS and cross sectional analysis, to inspect product and process quality and diagnose component failures. Reports and images can be transmitted electronically. For information about our electronics product testing capabilities, including destructive physical analysis, thermal cycling, contamination analysis and solderability, contact:

Ed Brothers (Senior Research Scientist, Microanalysis Specialist in NY),
Brett Miller (Lab Director in KY), or
Tom Ackerson (Lab Director in SC).

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Learn more about Ed Brothers, Senior Research Scientist.

Learn more about Brett Miller, P.E. - Laboratory Director.

Learn more about Thomas Ackerson, P.E. - Laboratory Director

Learn more about John DeFranks, Materials Engineer

Learn More about Mike Bimbo, Manager, Polymer & Specialty Chemistry

IMR performs a number of testing services, such as SEM/EDS, X-Ray, and more, including:

Chip on Circuit Board with
Solder Joint Highlighted

Etched Solder Joint
Copper/Solder Bond Highlighted

Intermetallic Layer Between
Solder & Copper

• Cross sectional analysis
• Photomicrographs
• Failure mode & defect analysis
• Real-time X-Ray Radiography
• Adhesion/bond strength
• DPA Destructive physical analysis
• Packaging problems
• Shear strength
• Plating thickness
• Conductivity & resistivity
• Thermal cycling
• Visual inspections
• SEM/EDS and FTIR analysis
• Contamination analysis
• Wire bond pull tests
• Silicon wafer defects
• Strain gaging
• Steam aging
• Solderability testing
• Thermal cycling
• Peel testing
• Tensile tests
• Dimensional verification
• Passive component failure