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ELECTRONICS

The electronics testing group relies on the extensive resources of the entire organization. Utilizing advanced tools and techniques to inspect product and process quality, and diagnose component failures. Reports and images can be transmitted electronically. For information about our destructive physical analysis, thermal cycling, and solderability testing capabilities, contact:

Ed Brothers (Senior Research Scientist in NY),
Brett Miller (Lab Director in KY), or
Melissa Gainey (Lab Manager in SC).

   

Tuesday, May 6,2008
   
   
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Related Bios
Learn more about Ed Brothers, Senior Research Scientist.
Learn more about Brett Miller, Sr. Metallurgical Engineer/Laboratory Director.
Learn more about Melissa Gainey, Laboratory Manager/Quality Director.
   
  Accreditations
IMR Test Labs Accreditations
   
 
Capabilities:  
Chip
Etched Solder Joint
Intermetallic Layer

• Cross sectional analysis
• Photomicrographs
• Failure mode & defect analysis
• Adhesion/bond strength
• DPA Destructive physical analysis
• Packaging problems
• Shear strength
• Plating thickness
• Conductivity & resistivity
• Thermal cycling
• Visual inspections
• SEM/EDS and FTIR analysis
• Contamination analysis
• Wire bond pull tests
• Silicon wafer defects
• Strain gaging
• Steam aging
• Solderability testing
• Thermal cycling
• Peel testing
• Tensile testing
• Dimensional verification
• Passive component failure